Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456226 | Semiconductor package and method of fabricating the same | Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2022-09-27 |
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +2 more | 2022-08-23 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo +2 more | 2022-05-03 |