Issued Patents 2022
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538735 | Method of forming integrated circuit packages with mechanical braces | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai +2 more | 2022-12-27 |
| 11538788 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2022-12-27 |
| 11532425 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Ming Hung Tseng | 2022-12-20 |
| 11532596 | Package structure and method of forming the same | Tsung-Yuan Yu, Hung-Yi Kuo, Cheng-Chieh Hsieh, Chung-Shi Liu, Chen-Hua Yu | 2022-12-20 |
| 11532594 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2022-12-20 |
| 11532529 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Tin-Hao Kuo | 2022-12-20 |
| 11527525 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai +2 more | 2022-12-13 |
| 11521959 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2022-12-06 |
| 11515268 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Tin-Hao Kuo, Shih-Wei Chen | 2022-11-29 |
| 11508656 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2022-11-22 |
| 11508671 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2022-11-22 |
| 11508665 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Chen-Hua Yu | 2022-11-22 |
| 11506843 | Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +4 more | 2022-11-22 |
| 11502013 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2022-11-15 |
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2022-11-15 |
| 11495590 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Chung-Shi Liu +1 more | 2022-11-08 |
| 11488897 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Chung-Shi Liu +1 more | 2022-11-01 |
| 11444002 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Chien Ling Hwang +4 more | 2022-09-13 |
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Chih-Wei Lin, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2022-08-23 |
| 11417638 | Semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Tin-Hao Kuo | 2022-08-16 |
| 11417610 | Post-passivation interconnect structure | Hsien-Wei Chen, Mirng-Ji Lii, Chen-Hua Yu | 2022-08-16 |
| 11417633 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Tin-Hao Kuo, Chung-Shi Liu | 2022-08-16 |
| 11410932 | Semiconductor device and method of manufacturing the same | Ming Hung Tseng, Cheng-Chieh Hsieh | 2022-08-09 |
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Chuei-Tang Wang +1 more | 2022-07-26 |
| 11374136 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu +2 more | 2022-06-28 |