Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532425 | Hexagonal semiconductor package structure | Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2022-12-20 |
| 11502039 | Semiconductor package and method | Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2022-11-15 |
| 11251644 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2022-02-08 |
| 11227837 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin | 2022-01-18 |