Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532596 | Package structure and method of forming the same | Tsung-Yuan Yu, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2022-12-20 |
| 11532425 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hao-Yi Tsai, Ming Hung Tseng | 2022-12-20 |
| 11521959 | Die stacking structure and method forming same | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu +1 more | 2022-12-06 |
| 11506843 | Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +4 more | 2022-11-22 |
| 11508656 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2022-11-22 |
| 11495590 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-08 |
| 11282791 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai, Shih-Wei Chen | 2022-03-22 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng | 2022-03-22 |
| 11251644 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Tzu-Sung Huang, Ming Hung Tseng | 2022-02-15 |
| 11251119 | Package structure, package-on-package structure and method of fabricating the same | Tsung-Yuan Yu, Cheng-Chieh Hsieh, Hao-Yi Tsai, Ming Hung Tseng | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hao-Yi Tsai +4 more | 2022-02-08 |