Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508671 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2022-11-22 |
| 11508665 | Packages with thick RDLs and thin RDLs stacked alternatingly | Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2022-11-22 |
| 11502013 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2022-11-15 |
| 11355466 | Package structure and manufacturing method of package structure thereof | Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2022-06-07 |
| 11289373 | Semiconductor package and manufacturing method thereof | Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2022-03-29 |
| 11282791 | Semiconductor device having a heat dissipation structure connected chip package | Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai, Shih-Wei Chen | 2022-03-22 |
| 11239135 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Chi-Hui Lai | 2022-02-01 |