Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410918 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier | Chen-Hua Yu, Hung-Jui Kuo, Ming-Che Ho | 2022-08-09 |
| 11398416 | Package structure and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho | 2022-07-26 |
| 11393763 | Integrated fan-out (info) package structure and method | Ming-Che Ho, Hung-Jui Kuo | 2022-07-19 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo +1 more | 2022-03-29 |
| 11289410 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Hung-Jui Kuo, Ming-Che Ho | 2022-03-29 |
| 11217518 | Package structure and method of forming the same | Hung-Jui Kuo, Ming-Che Ho | 2022-01-04 |