Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495507 | Manufacturing method of a semiconductor package | Shih-Hao Tseng, Hung-Jui Kuo, Chia-Hung Liu | 2022-11-08 |
| 11495506 | Semiconductor package with separate electric and thermal paths | Shih-Hao Tseng, Hung-Jui Kuo | 2022-11-08 |
| 11410918 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier | Chen-Hua Yu, Hung-Jui Kuo, Tzung-Hui Lee | 2022-08-09 |
| 11410953 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2022-08-09 |
| 11398416 | Package structure and method of fabricating the same | Tzung-Hui Lee, Hung-Jui Kuo | 2022-07-26 |
| 11393763 | Integrated fan-out (info) package structure and method | Hung-Jui Kuo, Tzung-Hui Lee | 2022-07-19 |
| 11387191 | Integrated circuit package and method | Chen-Hua Yu, Tzu-Yun Huang, Hung-Jui Kuo | 2022-07-12 |
| 11289410 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Hung-Jui Kuo, Tzung-Hui Lee | 2022-03-29 |
| 11239233 | Integrated circuit packages and methods of forming same | Yi-Wen Wu, Hung-Jui Kuo | 2022-02-01 |
| 11217518 | Package structure and method of forming the same | Tzung-Hui Lee, Hung-Jui Kuo | 2022-01-04 |