Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430776 | Semiconductor devices and methods of manufacturing | Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung, Po-Hao Tsai +1 more | 2022-08-30 |
| 11410953 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2022-08-09 |
| 11362010 | Structure and formation method of chip package with fan-out feature | Meng-Liang Lin, Po-Hao Tsai, Po-Yao Chuang, Techi Wong, Shin-Puu Jeng | 2022-06-14 |
| 11322447 | Dual-sided routing in 3D SiP structure | Po-Hao Tsai, Po-Yao Chuang, Meng-Liang Lin, Shin-Puu Jeng, Techi Wong | 2022-05-03 |
| 11302650 | Package structure and method of fabricating the same | Shin-Puu Jeng, Shih-Ting Hung, Po-Yao Chuang | 2022-04-12 |
| 11257714 | Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same | Chien Ling Hwang, Chun-Chieh Wang, Chung-Shi Liu | 2022-02-22 |
| 11239233 | Integrated circuit packages and methods of forming same | Hung-Jui Kuo, Ming-Che Ho | 2022-02-01 |