Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430739 | Structure and formation method of package structure with fan-out structure | Po-Hao Tsai, Hsien-Wen Liu, Shin-Puu Jeng, Meng-Liang Lin, Shih-Yung PENG | 2022-08-30 |
| 11430776 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Po-Hao Tsai +1 more | 2022-08-30 |
| 11302650 | Package structure and method of fabricating the same | Yi-Wen Wu, Shin-Puu Jeng, Po-Yao Chuang | 2022-04-12 |
| 11248867 | Modular magazine release for firearms | Shanyao Lee | 2022-02-15 |