Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430739 | Structure and formation method of package structure with fan-out structure | Po-Hao Tsai, Hsien-Wen Liu, Shin-Puu Jeng, Meng-Liang Lin, Shih-Ting Hung | 2022-08-30 |
SP
Shih-Yung PENG
Overall (2022): #259,823 of 548,613Top 50%
1
Patents 2022