Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495506 | Semiconductor package with separate electric and thermal paths | Hung-Jui Kuo, Ming-Che Ho | 2022-11-08 |
| 11495507 | Manufacturing method of a semiconductor package | Hung-Jui Kuo, Ming-Che Ho, Chia-Hung Liu | 2022-11-08 |