Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515224 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, Ming-Tan Lee | 2022-11-29 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2022-03-29 |
| 11215929 | Photoresist system and method | Hung-Jui Kuo, Chen-Hua Yu, Ming-Tan Lee | 2022-01-04 |