Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515224 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, Hui-Jung Tsai, De-Yuan Lu | 2022-11-29 |
| 11215929 | Photoresist system and method | Hung-Jui Kuo, De-Yuan Lu, Chen-Hua Yu | 2022-01-04 |