Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515224 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Hui-Jung Tsai, De-Yuan Lu, Ming-Tan Lee | 2022-11-29 |
| 11515276 | Integrated circuit, package structure, and manufacturing method of package structure | Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang | 2022-11-29 |
| 11508633 | Package structure having taper-shaped conductive pillar and method of forming thereof | Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang | 2022-11-22 |
| 11378886 | Method for removing resist layer, and method of manufacturing semiconductor | Hung-Jui Kuo, Hui-Jung Tsai | 2022-07-05 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo +1 more | 2022-03-29 |