CW

Chia-Wei Wang

TSMC: 3 patents #883 of 3,577Top 25%
ME Mediatek: 1 patents #114 of 350Top 35%
SA Sakti3: 1 patents #1 of 3Top 35%
📍 Hsinchu, MI: #2 of 12 inventorsTop 20%
Overall (2022): #33,665 of 548,613Top 7%
5
Patents 2022

Issued Patents 2022

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
11539070 Method for manufacture and structure of multiple electrochemistries and energy gathering components within a unified structure Fabio Albano, Ann Marie Sastry 2022-12-27
11515276 Integrated circuit, package structure, and manufacturing method of package structure Hung-Jui Kuo, Hui-Jung Tsai, Tai-Min Chang 2022-11-29
11508633 Package structure having taper-shaped conductive pillar and method of forming thereof Hung-Jui Kuo, Hui-Jung Tsai, Tai-Min Chang 2022-11-22
11450641 Method of fabricating package structure Hung-Jui Kuo, Hui-Jung Tsai, Yu-Tzu Chang 2022-09-20
11222691 Double-pitch-layout techniques and apparatus thereof Tun-Fei Chien 2022-01-11