Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450641 | Method of fabricating package structure | Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang | 2022-09-20 |
YC
Yu-Tzu Chang
Overall (2022): #194,981 of 548,613Top 40%
1
Patents 2022