Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2022-03-29 |
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Bor-Rung Su
Overall (2022): #513,582 of 548,613Top 95%
1
Patents 2022