Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508656 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2022-11-22 |
| 11508671 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Chih-Yu Wang | 2022-11-22 |
| 11450581 | Integrated circuit package and method | Lipu Kris Chuang, Hsin-Yu Pan | 2022-09-20 |