Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo +2 more | 2022-06-07 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang | 2022-03-08 |