Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538761 | Semiconductor package having molded die and semiconductor die and manufacturing method thereof | Hao-Cheng Hou, Wei-Yu Chen, Jung Wei Cheng, Tsung-Ding Wang, Chung-Shi Liu | 2022-12-27 |
| 11532587 | Method for manufacturing semiconductor package with connection structures including via groups | Chien-Hsun Chen, Jiun Yi Wu, Chung-Shi Liu | 2022-12-20 |
| 11488881 | Semiconductor device and method of manufacture | Chen-Hua Yu, Jiun Yi Wu | 2022-11-01 |
| 11457525 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2022-09-27 |
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2022-08-23 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung Wei Cheng +3 more | 2022-08-02 |
| 11387118 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chi-Yang Yu, Jung Wei Cheng, Chin-Liang Chen | 2022-07-12 |
| RE49045 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Yung Ching Chen | 2022-04-19 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Hao-Cheng Hou, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang, Yi-Yang Lei | 2022-03-08 |
| 11258151 | Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric material | Jiun Yi Wu, Chewn-Pu Jou, Fu-Lung Hsueh | 2022-02-22 |
| 11244879 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang | 2022-02-08 |
| 11217497 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Jiun Yi Wu, Chung-Shi Liu | 2022-01-04 |
| 11217538 | Integrated circuit package and method | Chung-Shi Liu, Jiun Yi Wu | 2022-01-04 |