Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2022-08-23 |
| 11355461 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2022-06-07 |