Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Chun-Chih Chuang +2 more | 2022-08-23 |
| 11394837 | System and method using matrix barcode information to process documents | Chun-Cheih Liao, Chun-Ping Huang | 2022-07-19 |