Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538761 | Semiconductor package having molded die and semiconductor die and manufacturing method thereof | Wei-Yu Chen, Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Chung-Shi Liu | 2022-12-27 |
| 11499080 | Thermal interface material, and preparation and application thereof | Wen Dai, Zhengde Lin, Nan Jiang, Jinhong Yu, Dan Dai | 2022-11-15 |
| 11466805 | Intelligent plugging robot and method for long-distance pipeline rerouting, maintaining and repairing construction | Yang Tang, Yuan Wang, Haoyu Xiong, Jinzhong Wang, Mingbo Wang +8 more | 2022-10-11 |
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2022-08-23 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hung-Jui Kuo, Jung Wei Cheng +3 more | 2022-08-02 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Chien-Hsun Lee, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang, Yi-Yang Lei | 2022-03-08 |