Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11499080 | Thermal interface material, and preparation and application thereof | Wen Dai, Zhengde Lin, Jinhong Yu, Dan Dai, Hao-Cheng Hou | 2022-11-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11499080 | Thermal interface material, and preparation and application thereof | Wen Dai, Zhengde Lin, Jinhong Yu, Dan Dai, Hao-Cheng Hou | 2022-11-15 |