Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin +2 more | 2022-08-23 |
CC
Chun-Chih Chuang
Overall (2022): #502,599 of 548,613Top 95%
1
Patents 2022