Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538761 | Semiconductor package having molded die and semiconductor die and manufacturing method thereof | Hao-Cheng Hou, Wei-Yu Chen, Tsung-Ding Wang, Chien-Hsun Lee, Chung-Shi Liu | 2022-12-27 |
| 11424199 | Connector formation methods and packaged semiconductor devices | Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2022-08-23 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2022-08-02 |
| 11387118 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Chi-Yang Yu, Chin-Liang Chen | 2022-07-12 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu, Tsung-Ding Wang, Yi-Yang Lei | 2022-03-08 |
| 11244879 | Semiconductor package | Chi-Yang Yu, Chien-Hsun Lee, Tsung-Ding Wang, Yu-Min Liang | 2022-02-08 |