Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508640 | Semiconductor package and manufacturing method thereof | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2022-11-22 |
| 11424220 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2022-08-23 |
| 11387118 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Chin-Liang Chen | 2022-07-12 |
| 11355461 | Integrated fan-out package and manufacturing method thereof | Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2022-06-07 |
| 11315862 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Yu-Min Liang, Wei-Yu Chen | 2022-04-26 |
| 11264304 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2022-03-01 |
| 11244879 | Semiconductor package | Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang | 2022-02-08 |