Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508640 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen | 2022-11-22 |
| 11424220 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2022-08-23 |
| 11417643 | Package-on-package with redistribution structure | Yu-Chih Liu, Kuan-Lin Ho, Wei-Ting Lin, Jing Ruei Lu | 2022-08-16 |
| 11387118 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Chi-Yang Yu, Jung Wei Cheng | 2022-07-12 |
| 11355461 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2022-06-07 |
| 11348874 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Jiun Yi Wu, Yen-Ping Wang | 2022-05-31 |
| 11315862 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2022-04-26 |
| 11264304 | Semiconductor structure and associated method for manufacturing the same | Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang | 2022-03-01 |