Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508640 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Wen-Lin Chen | 2022-11-22 |
| 11424220 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang | 2022-08-23 |
| 11417643 | Package-on-package with redistribution structure | Yu-Chih Liu, Wei-Ting Lin, Chin-Liang Chen, Jing Ruei Lu | 2022-08-16 |
| 11355461 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Yu-Min Liang | 2022-06-07 |
| 11315862 | Semiconductor structure and manufacturing method thereof | Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2022-04-26 |
| 11264304 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2022-03-01 |