Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515173 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yen-Ping Wang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2022-11-29 |
| 11508640 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Wen-Lin Chen | 2022-11-22 |
| 11424220 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen | 2022-08-23 |
| 11355461 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho | 2022-06-07 |
| 11315862 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Wei-Yu Chen | 2022-04-26 |
| 11282779 | Package structure and fabricating method thereof | Kai-Chiang Wu, Jiun Yi Wu | 2022-03-22 |
| 11282761 | Semiconductor packages and methods of manufacturing the same | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2022-03-22 |
| 11264304 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho | 2022-03-01 |
| 11244879 | Semiconductor package | Chi-Yang Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang | 2022-02-08 |