Issued Patents 2022
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515274 | Semiconductor package and manufacturing method thereof | Fang-Yu Liang, Hsiu-Jen Lin, Chih-Chiang Tsao | 2022-11-29 |
| 11515173 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Yen-Ping Wang, Jiun Yi Wu, Chen-Hua Yu | 2022-11-29 |
| 11461204 | Data processing circuit and fault-mitigating method | Shu-Ming Liu, Wen Li Tang | 2022-10-04 |
| 11424197 | Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu | 2022-08-23 |
| 11417616 | Package structure and manufacturing method thereof | Han-Ping Pu, Yen-Ping Wang | 2022-08-16 |
| 11398422 | Package structure and fabricating method thereof | Chun-Lin Lu, Jiun Yi Wu | 2022-07-26 |
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2022-07-26 |
| 11373922 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Hsin-Yu Pan, Yi-Che Chiang | 2022-06-28 |
| 11362009 | Package structure and method of fabricating the same | Sheng-Ta Lin, Chun-Lin Lu | 2022-06-14 |
| 11348874 | Semiconductor packages and forming methods thereof | Chin-Liang Chen, Jiun Yi Wu, Yen-Ping Wang | 2022-05-31 |
| 11342269 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu | 2022-05-24 |
| 11315891 | Methods of forming semiconductor packages having a die with an encapsulant | Chung-Hao Tsai, Chia-Chia Lin, Chuei-Tang Wang, Chen-Hua Yu | 2022-04-26 |
| RE49046 | Methods and apparatus for package on package devices | Ming-Kai Liu, Hsien-Wei Chen, Shih-Wei Liang | 2022-04-19 |
| 11309242 | Package component, semiconductor package and manufacturing method thereof | Fang-Yu Liang | 2022-04-19 |
| 11296012 | Barrier structures between external electrical connectors | Chia-Chun Miao, Shih-Wei Liang | 2022-04-05 |
| 11289418 | Package structure and manufacturing method thereof | Chien Ling Hwang, Chun-Lin Lu | 2022-03-29 |
| 11282779 | Package structure and fabricating method thereof | Jiun Yi Wu, Yu-Min Liang | 2022-03-22 |
| 11282817 | Semiconductor device package including embedded conductive elements | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng | 2022-03-22 |
| 11264316 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Chun-Lin Lu | 2022-03-01 |
| 11239096 | Integrated fan-out package and manufacturing method thereof | Chung-Hao Tsai, Chun-Lin Lu, Yen-Ping Wang, Che-Wei Hsu | 2022-02-01 |
| 11233019 | Manufacturing method of semicondcutor package | Fang-Yu Liang, Ching-Feng Yang | 2022-01-25 |