Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515274 | Semiconductor package and manufacturing method thereof | Fang-Yu Liang, Hsiu-Jen Lin, Kai-Chiang Wu | 2022-11-29 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang +3 more | 2022-10-25 |
| 11374303 | Package structure and method of fabricating the same | Fang-Yu Liang | 2022-06-28 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2022-05-24 |