Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342321 | Manufacturing method of package on package structure | Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2022-05-24 |
HK
Hsuan-Ting Kuo
Overall (2022): #428,696 of 548,613Top 80%
1
Patents 2022