Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515274 | Semiconductor package and manufacturing method thereof | Hsiu-Jen Lin, Kai-Chiang Wu, Chih-Chiang Tsao | 2022-11-29 |
| 11374303 | Package structure and method of fabricating the same | Chih-Chiang Tsao | 2022-06-28 |
| 11309242 | Package component, semiconductor package and manufacturing method thereof | Kai-Chiang Wu | 2022-04-19 |
| 11233019 | Manufacturing method of semicondcutor package | Ching-Feng Yang, Kai-Chiang Wu | 2022-01-25 |