Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2022-07-26 |
| RE49046 | Methods and apparatus for package on package devices | Ming-Kai Liu, Kai-Chiang Wu, Hsien-Wei Chen | 2022-04-19 |
| 11296012 | Barrier structures between external electrical connectors | Chia-Chun Miao, Kai-Chiang Wu | 2022-04-05 |