Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2022-07-26 |
HC
Hao-Hsiang Chuang
Overall (2022): #440,603 of 548,613Top 85%
1
Patents 2022