Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424197 | Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2022-08-23 |
| 11398422 | Package structure and fabricating method thereof | Jiun Yi Wu, Kai-Chiang Wu | 2022-07-26 |
| 11362009 | Package structure and method of fabricating the same | Sheng-Ta Lin, Kai-Chiang Wu | 2022-06-14 |
| 11342269 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2022-05-24 |
| 11289418 | Package structure and manufacturing method thereof | Chien Ling Hwang, Kai-Chiang Wu | 2022-03-29 |
| 11264316 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Kai-Chiang Wu | 2022-03-01 |
| 11239096 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Yen-Ping Wang, Che-Wei Hsu | 2022-02-01 |