Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515173 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu | 2022-11-29 |
| 11417616 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Han-Ping Pu | 2022-08-16 |
| 11348874 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Chin-Liang Chen, Jiun Yi Wu | 2022-05-31 |
| 11329022 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Ching-Jung Yang | 2022-05-10 |
| 11239096 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Chun-Lin Lu, Che-Wei Hsu | 2022-02-01 |
| 11225098 | System of assessing performance of a photocuring light source for a printing machine and a combination having same | Shih Chang Chang, Chia-Bin Chueh, Kang-Yu Liu | 2022-01-18 |