Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476125 | Multi-die package with bridge layer | Wei Sen Chang, Chen-Shien Chen, Mirng-Ji Lii | 2022-10-18 |
| 11282817 | Semiconductor device package including embedded conductive elements | Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng, Kai-Chiang Wu | 2022-03-22 |