Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532692 | Process for tuning via profile in dielectric material | Chun-Kai Tzeng, Cheng-Jen Lin, Yung-Ching Chao, Ming-Da Cheng | 2022-12-20 |
| 11532583 | Semiconductor structure and manufacturing method thereof | Kuo-Chin Chang, Yen-Kun Lai, Kuo-Ching Hsu | 2022-12-20 |
| 11476125 | Multi-die package with bridge layer | Wei Sen Chang, Yu-Feng Chen, Chen-Shien Chen | 2022-10-18 |
| 11462509 | Package structure with electronic device in cavity substrate and method for forming the same | Po-Hao Tsai, Ming-Da Cheng | 2022-10-04 |
| 11450588 | Method for forming chip package structure with heat conductive layer | Shin CHI, Chien-Hao Hsu, Kuo-Chin Chang, Cheng-Nan Lin | 2022-09-20 |
| 11417610 | Post-passivation interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu | 2022-08-16 |
| 11393771 | Bonding structures in semiconductor packaged device and method of forming same | Hao-Chun Liu, Ching-Wen Hsiao, Kuo-Ching Hsu | 2022-07-19 |
| 11342291 | Semiconductor packages with crack preventing structure | Yao-Chun Chuang, Hong-Seng Shue, Chen-Nan Chiu, Li-Huan Chu | 2022-05-24 |
| 11315896 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Chen-Hua Yu, Sheng-Yu Wu, Yao-Chun Chuang | 2022-04-26 |
| 11264342 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Meng-Tse Chen, Wei-Hung Lin | 2022-03-01 |
| 11244919 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Chen-Shien Chen, Kuo-Ching Hsu | 2022-02-08 |
| 11239305 | Display device and manufacturing method thereof | Sheng-Yu Wu, Shang-Yun Tu, Ching-Hui Chen | 2022-02-01 |
| 11222859 | Semiconductor device structure with bonding pad and method for forming the same | Chien-Hao Hsu, Wei-Hsiang Tu, Kuo-Chin Chang | 2022-01-11 |