Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532583 | Semiconductor structure and manufacturing method thereof | Yen-Kun Lai, Kuo-Ching Hsu, Mirng-Ji Lii | 2022-12-20 |
| 11495556 | Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same | Pei-Haw Tsao, An Xu, Huang-Ting Hsiao | 2022-11-08 |
| 11450588 | Method for forming chip package structure with heat conductive layer | Shin CHI, Chien-Hao Hsu, Cheng-Nan Lin, Mirng-Ji Lii | 2022-09-20 |
| 11380639 | Shielding structures | Chih-Fan Huang, Hui-Chi Chen, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen +1 more | 2022-07-05 |
| 11222859 | Semiconductor device structure with bonding pad and method for forming the same | Chien-Hao Hsu, Wei-Hsiang Tu, Mirng-Ji Lii | 2022-01-11 |