Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495556 | Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same | Pei-Haw Tsao, An Xu, Kuo-Chin Chang | 2022-11-08 |
HH
Huang-Ting Hsiao
Overall (2022): #427,935 of 548,613Top 80%
1
Patents 2022