DC

Dian-Hau Chen

TSMC: 12 patents #163 of 3,577Top 5%
Overall (2022): #5,963 of 548,613Top 2%
12
Patents 2022

Issued Patents 2022

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
11532695 Stress reduction structure for metal-insulator-metal capacitors Jin-Mu Yin, Hung-Chao Kao, Hsiang-Ku Shen, Yen-Ming Chen 2022-12-20
11502182 Selective gate air spacer formation Chih-Hsin Yang, Yen-Ming Chen, Feng-Cheng Yang, Tsung-Lin Lee, Wei-Yang Lee 2022-11-15
11444173 Semiconductor device structure with salicide layer and method for forming the same Hsiang-Ku Shen, Jin-Mu Yin, Tsung-Chieh Hsiao, Chia-Lin Chuang, Li-Zhen Yu +14 more 2022-09-13
11437331 Chip structure and method for forming the same Chih-Fan Huang, Mao-Nan Wang, Hui-Chi Chen, Yen-Ming Chen 2022-09-06
11424319 Multilayer capacitor electrode Hsiang-Ku Shen 2022-08-23
11380639 Shielding structures Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Hong-Seng Shue +1 more 2022-07-05
11362170 Metal-insulator-metal (MIM) capacitor structure and method for forming the same Chih-Fan Huang, Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen +1 more 2022-06-14
11355436 Semiconductor device and manufacturing method thereof Yu-Bey Wu, Jye-Yen Cheng, Sheng-Hsuan Wei, Li-Yu Lee, TaiYang Wu 2022-06-07
11342408 Metal-insulator-metal structure and methods of fabrication thereof Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen +2 more 2022-05-24
11239142 Package structure and method for forming the same Chih-Fan Huang, Hsiang-Ku Shen, Hui-Chi Chen, Tien-I Bao, Yen-Ming Chen 2022-02-01
11222857 Method of forming a photoresist over a bond pad to mitigate bond pad corrosion Chih-Fan Huang, Mao-Nan Wang, Tzu-Li Lee, Yen-Ming Chen, Tzung-Luen Li 2022-01-11
11222946 Semiconductor device including a high density MIM capacitor and method Jin-Mu Yin, Hung-Chao Kao, Hui-Chi Chen, Hsiang-Ku Shen, Yen-Ming Chen 2022-01-11