Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424188 | Methods of fabricating integrated circuit devices having raised via contacts | Kuo-Chiang Tsai, Jyh-Huei Chen | 2022-08-23 |
| 11355436 | Semiconductor device and manufacturing method thereof | Yu-Bey Wu, Dian-Hau Chen, Sheng-Hsuan Wei, Li-Yu Lee, TaiYang Wu | 2022-06-07 |
| 11348828 | Interconnect structure and method of forming the same | Chen-Yu Shyu, Ming-Shuoh Liang | 2022-05-31 |