Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508616 | Electrical connection for semiconductor devices | Jyh-Huei Chen | 2022-11-22 |
| 11424188 | Methods of fabricating integrated circuit devices having raised via contacts | Jyh-Huei Chen, Jye-Yen Cheng | 2022-08-23 |
| 11393717 | Insulating cap on contact structure and method for forming the same | Fu-Hsiang Su, Ke-Jing Yu, Jyh-Huei Chen | 2022-07-19 |
| 11239114 | Semiconductor device with reduced contact resistance and methods of forming the same | Jhy-Huei Chen | 2022-02-01 |
| 11222821 | Semiconductor device with reduced via bridging risk | Szu-Wei Tseng | 2022-01-11 |