Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508616 | Electrical connection for semiconductor devices | Kuo-Chiang Tsai | 2022-11-22 |
| 11424188 | Methods of fabricating integrated circuit devices having raised via contacts | Kuo-Chiang Tsai, Jye-Yen Cheng | 2022-08-23 |
| 11393717 | Insulating cap on contact structure and method for forming the same | Kuo-Chiang Tsai, Fu-Hsiang Su, Ke-Jing Yu | 2022-07-19 |