Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437331 | Chip structure and method for forming the same | Chih-Fan Huang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2022-09-06 |
| 11222857 | Method of forming a photoresist over a bond pad to mitigate bond pad corrosion | Chih-Fan Huang, Dian-Hau Chen, Tzu-Li Lee, Yen-Ming Chen, Tzung-Luen Li | 2022-01-11 |