Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437331 | Chip structure and method for forming the same | Mao-Nan Wang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2022-09-06 |
| 11380639 | Shielding structures | Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen +1 more | 2022-07-05 |
| 11362170 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen, Dian-Hau Chen +1 more | 2022-06-14 |
| 11342408 | Metal-insulator-metal structure and methods of fabrication thereof | Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen, Hui-Chi Chen +2 more | 2022-05-24 |
| 11239142 | Package structure and method for forming the same | Hsiang-Ku Shen, Hui-Chi Chen, Tien-I Bao, Dian-Hau Chen, Yen-Ming Chen | 2022-02-01 |
| 11222857 | Method of forming a photoresist over a bond pad to mitigate bond pad corrosion | Dian-Hau Chen, Mao-Nan Wang, Tzu-Li Lee, Yen-Ming Chen, Tzung-Luen Li | 2022-01-11 |