Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380639 | Shielding structures | Chih-Fan Huang, Hui-Chi Chen, Kuo-Chin Chang, Chien-Huang Yeh, Dian-Hau Chen +1 more | 2022-07-05 |
| 11348884 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Wei Sen Chang, Ching-Wen Hsiao +1 more | 2022-05-31 |
| 11342291 | Semiconductor packages with crack preventing structure | Yao-Chun Chuang, Chen-Nan Chiu, Li-Huan Chu, Mirng-Ji Lii | 2022-05-24 |