Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342291 | Semiconductor packages with crack preventing structure | Yao-Chun Chuang, Hong-Seng Shue, Li-Huan Chu, Mirng-Ji Lii | 2022-05-24 |
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Chen-Nan Chiu
Overall (2022): #502,788 of 548,613Top 95%
1
Patents 2022